Semiconductor innovation into the next decade

Author

Sun, Jack Y.-C

Author_Institution

R&D, & CTO Office, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan

fYear

2014

fDate

10-12 Nov. 2014

Firstpage

117

Lastpage

120

Abstract

Semiconductor innovation through a new paradigm of 3D×3D System Scaling can carry the industry into the next decade. Besides the internet of things (IoT), cloud computing, and big data analytics, we can imagine a bionic age emerging with digitally-enhanced or semiconductor-augmented vision, hearing, limbs, and many other capabilities, such as cognitive computing, universal translators, and brain wave interfaces/communications. It is important to leverage the silicon platform and be part of a symbiotic ecosystem, such as TSMC´s Grand Alliance and OIP platform, to enjoy the benefits of the economies of scale and collective innovation power.

Keywords

monolithic integrated circuits; semiconductor technology; Internet of Things; OIP platform; TSMC; big data analytics; brain wave interfaces/communications; cloud computing; cognitive computing; semiconductor innovation; system scaling; universal translators; CMOS integrated circuits; Ecosystems; Energy efficiency; Stacking; Technological innovation; Three-dimensional displays; Transistors; 3DIC; CMOS; CoWoS; InFO; IoT; Moore´s Law; ecosystem; foundry; platform; sensor; system scaling;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference (A-SSCC), 2014 IEEE Asian

Conference_Location

KaoHsiung

Print_ISBN

978-1-4799-4090-5

Type

conf

DOI

10.1109/ASSCC.2014.7008874

Filename

7008874