Title :
CMOS THz transmissive imaging system
Author :
Tzu-Chao Yan ; Chun-Hsing Li ; Chih-Wei Lai ; Wei-Cheng Chen ; Tzu-Yuan Chao ; Chien-Nan Kuo
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
Abstract :
This paper presents a THz imaging system composed of a signal source and a signal sensor in CMOS technology. The signal source integrates a 338 GHz oscillator in 40-nm CMOS and an antenna array on a Benzocyclobutene (BCB) carrier using the SoP (System-on-Package) technique. The measured EIRP achieves +8 dBm. The signal sensor is implemented in 0.18 μm CMOS. The measured maximum responsivity is 632 kV/W at 332 GHz. The signal source and signal sensor consume dc power of 37.5 mW and 7.92 mW, respectively. The resolution of the proposed THz imaging system is 4 mm.
Keywords :
CMOS image sensors; MMIC oscillators; antenna arrays; submillimetre wave oscillators; system-on-package; terahertz wave imaging; BCB carrier; Benzocyclobutene carrier; CMOS THz transmissive imaging system; CMOS technology; SoP technique; antenna array; frequency 332 GHz; frequency 338 GHz; measured EIRP; measured maximum responsivity; oscillator; power 37.5 mW; power 7.92 mW; signal sensor; signal source; size 0.18 mum; size 40 nm; system-on-package technique; Antenna arrays; CMOS integrated circuits; CMOS technology; Detectors; Imaging; Lenses; Solid state circuits; CMOS; System-on-Package (SoP); THz imaging system; signal sensor; signal source;
Conference_Titel :
Solid-State Circuits Conference (A-SSCC), 2014 IEEE Asian
Conference_Location :
KaoHsiung
Print_ISBN :
978-1-4799-4090-5
DOI :
10.1109/ASSCC.2014.7008887
