A frequency-reconfigurable multi-standard 65nm CMOS digital transmitter with LTCC interposers

Author

Nai-Chung Kuo ; Bonjern Yang ; Chaoying Wu ; Lingkai Kong ; Wang, Aiping ; Reiha, Michael ; Alon, Elad ; Niknejad, Ali M. ; Nikolic, B.

Author_Institution

Berkeley Wireless Res. Center, Berkeley, CA, USA

fYear

2014

fDate

10-12 Nov. 2014

Firstpage

345

Lastpage

348

Abstract

This paper demonstrates a CMOS digital polar transmitter with flip-chip interconnection to low-temperature co-fired ceramic (LTCC) interposers. The LTCC interposers contain the PA output balun targeting different operating frequency bands, and the reconfiguration in the carrier frequency is achieved by selecting an appropriate LTCC interposer. The same CMOS core transmitter is reused for different frequency bands. In this design, an output power higher than 22 dBm from 0.6 to 2.4 GHz is demonstrated, with peak power of 27.1 dBm and peak efficiency of 52%. The polar transmitter includes 9-bit phase interpolation and 8-bit amplitude modulation, suitable and verified as a multi-standard universal digital modulator.

Keywords

CMOS digital integrated circuits; UHF integrated circuits; amplitude modulation; ceramics; cryogenic electronics; flip-chip devices; integrated circuit interconnections; interpolation; transmitters; LTCC interposers; PA output balun; amplitude modulation; carrier frequency reconfiguration; core transmitter; digital polar transmitter; efficiency 52 percent; flip-chip interconnection; frequency 0.6 GHz to 2.4 GHz; frequency-reconfigurable multistandard CMOS; low-temperature cofired ceramic interposers; operating frequency bands; phase interpolation; polar transmitter; power amplifier; size 65 nm; universal digital modulator; word length 8 bit; word length 9 bit; CMOS integrated circuits; Frequency modulation; Impedance matching; OFDM; Phase modulation; Power amplifiers; Transmitters; CMOS; LTCC; digital polar modulation; digital transmitter; power amplifier;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference (A-SSCC), 2014 IEEE Asian

Conference_Location

KaoHsiung

Print_ISBN

978-1-4799-4090-5

Type

conf

DOI

10.1109/ASSCC.2014.7008931

Filename

7008931