• DocumentCode
    1797773
  • Title

    Application of digital technology in ballistic mortar for determining the power of high explosives

  • Author

    Tuan Son Nguyen ; Tien Thanh Nguyen ; Thi Thu Thuy Nguyen ; Anh Hai Nguyen

  • Author_Institution
    Center for Weapon Meas. & Exprirement, Griffith Univ., Griffith, NSW, Australia
  • fYear
    2014
  • fDate
    15-17 Nov. 2014
  • Firstpage
    471
  • Lastpage
    476
  • Abstract
    The following paper researches into application of digital technology for explosives performance test, especially ballistic mortar test. The proposed approach provides a direct measurement of maximum throw angle of pendulum in ballistic mortar test. The measurement equipment for ballistic mortar (MEBM) is designed, produced, and applied in the defense industries in Vietnam. MEBM is developed and produced based on angle encoder, CPU S7 200, TD 200. With the new proposed approach, the measurement process, signal transfer, digital signal processing, data computing, and display are fully automatic. It overcomes the disadvantages of old approach, such as indirect measurement of throw angle, where measurement error depending on marker record, rule, and subjectivity of measurer. The testing and triggering detonator is integrated in MEBM.
  • Keywords
    angular measurement; ballistics; digital instrumentation; explosives; measurement errors; pendulums; signal processing; weapons; CPU S7 200; MEBM; TD 200; Vietnam; angle encoder; ballistic mortar test; data computing; defense industries; digital signal processing; digital technology; explosive performance test; maximum throw angle; measurement equipment; measurement error; measurement process; signal transfer; triggering detonator; Accuracy; Explosives; Mortar; Projectiles; Testing; Time measurement; CPU S7 200; ballistic mortar test; encoder; explosives performance test;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Systems and Informatics (ICSAI), 2014 2nd International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4799-5457-5
  • Type

    conf

  • DOI
    10.1109/ICSAI.2014.7009334
  • Filename
    7009334