Evaluation of thermal interface material with electric capacitance measurement: A new method using metal meshes to present finer surface roughness levels

Author

Saito, Yuya ; Suzuki, Satoshi ; Komuro, Takanori

Author_Institution

Dept. of Electr. & Electron. Eng., Kanagawa Inst. of Technol., Atsugi, Japan

fYear

2014

fDate

4-6 Nov. 2014

Firstpage

11

Lastpage

14

Abstract

In electronic devices, the thermal characteristics of thermal interface materials are strongly affected by their heat sink contact conditions. In this study, we evaluate the thermal contact resistance between a heat sink and thermal interface materials and then present heat sink roughness levels using metal meshes. We also confirm the effectiveness of our new method via thermal resistance and electrical capacitance measurement experiments.

Keywords

capacitance measurement; contact resistance; heat sinks; surface roughness; thermal resistance; thermal resistance measurement; electric capacitance measurement; electrical capacitance measurement; electronic devices; heat sink; metal meshes; surface roughness; thermal contact resistance; thermal interface material evaluation; thermal interface materials; thermal resistance measurement; Capacitance; Capacitance measurement; Heat sinks; Materials; Metals; Thermal resistance; Asker C hardness; Capacitance measurement; Thermal interface material; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

CPMT Symposium Japan (ICSJ), 2014 IEEE

Conference_Location

Kyoto

Print_ISBN

978-1-4799-6194-8

Type

conf

DOI

10.1109/ICSJ.2014.7009597

Filename

7009597