Title :
Low power penalty, dry-film polymer waveguides for silicon photonics chip packaging
Author :
Hsiang-Han Hsu ; Nakagawa, Sachiko
Author_Institution :
Opt. Interconnect Technol., IBM Res. - Tokyo, Kawasaki, Japan
Abstract :
Two types of polymer waveguides made by dry film process are characterized for silicon photonics chip packaging. In this paper, both DC and high-speed performance of the waveguides are demonstrated. DC characterization includes coupling loss from/to a single-mode fiber (SMF), near field pattern (NFP), far field pattern (FFP), and alignment tolerance measurement. The designed values for the waveguide cores are 10 μm in height and 14 μm in width. In terms of obtaining small enough coupling loss with butt coupling between the waveguides and SMFs, two kinds of numerical aperture (NA), 0.13 and 0.35, are selected. On the other hand, high-speed transmission experiments were tested by eye patterns. Clear eye openings were observed up to 25 Gbps. The results show dry-film polymer waveguides are one of a promising solutions for silicon photonics chip packaging used in next generation optical multi-chip module (MCM).
Keywords :
multichip modules; optical interconnections; optical losses; optical waveguides; polymers; DC performance; alignment tolerance measurement; coupling loss; dry film polymer waveguide; eye pattern; far field pattern; high speed performance; low power penalty waveguide; near field pattern; optical multichip module; silicon photonics chip packaging; single-mode fiber; size 10 mum to 14 mum; waveguide cores; Couplings; Loss measurement; Optical waveguides; Polymers; Propagation losses; Silicon photonics; Waveguide lasers; dry film; polymer waveguide;
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2014 IEEE
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-6194-8
DOI :
10.1109/ICSJ.2014.7009599
