Miniaturized LTE modem SiP using novel multiple compartments shielding

Author

Leou, Jl ; Chen, Vincent ; Chen, Jiann-Jong ; Wang, Tao ; Chang, H.

Author_Institution

ASE Group, Taipei, Taiwan

fYear

2014

fDate

4-6 Nov. 2014

Firstpage

51

Lastpage

54

Abstract

This paper describes a miniaturized LTE SiP modem target for the smallest form factor among the product category. A Novel compartment shielding process is used to implement multiple shielded areas to reduce the interference between digital, analog and RF circuits. The result shows that this modem has excellent RF performance and meets all 3GPP LTE Category 3 (downlink speed can reach 100Mbps) and carrier´s requirements. This SiP module passed FCC and CE EMI regulatory tests, and also passed GCF and PTCRB certification. Also, the reliability test shows this process meets consumer applications such as LTE modem for tablet. It is found that this compartment shielding process is good for consumer grade SiP module both in technology and in commercial terms.

Keywords

Long Term Evolution; analogue circuits; digital circuits; electromagnetic interference; electromagnetic shielding; interference suppression; modems; telecommunication network reliability; 3GPP LTE category 3; CE EMI regulatory tests; FCC EMI regulatory tests; GCF certification; PTCRB certification; RF circuits; SiP; analog circuits; compartment shielding process; digital circuits; miniaturized LTE modem; multiple compartments shielding; Metals; Modems; Performance evaluation; Radio frequency; Sensitivity; Substrates; Transceivers; CPS; LTE; RF Design; Shielding;

fLanguage

English

Publisher

ieee

Conference_Titel

CPMT Symposium Japan (ICSJ), 2014 IEEE

Conference_Location

Kyoto

Print_ISBN

978-1-4799-6194-8

Type

conf

DOI

10.1109/ICSJ.2014.7009607

Filename

7009607