Title :
Soldering material for fine PoP (Package on Package)
Author :
Hashimoto, Yo ; Nakano, Shunsuke ; Takagi, Kazuyoshi ; Kawamata, Yuji
Author_Institution :
Solder Tech. Center, Senju Metal Ind. Co., Ltd., Tokyo, Japan
Abstract :
The packages for PoP process will become finer as 0.3mm pitch and it is necessary for solder materials to choice finer powder as Type6 because of the better transfer capability and soldering capability.
Keywords :
fine-pitch technology; packaging; soldering; Type6; fine PoP; finer powder; package on package; size 0.3 mm; soldering material; Hip; Joints; Nitrogen; Powders; Soldering; 0.3mm pitch BGA; Soldering; dippable paste;
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2014 IEEE
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-6194-8
DOI :
10.1109/ICSJ.2014.7009613
