Title :
A feasibility study of novel packaging technology for low cost and high performance systems
Author :
Iguchi, Daisuke ; Umekawa, Hideyuki
Author_Institution :
Electr. Device Eng., Fuji Xerox Co., Ltd., Ebina, Japan
Abstract :
We have introduced a packaging technology utilizing high-dielectric ultra thin film between power and ground planes not as an embedded capacitor but a low impedance power distribution route directly connected to the chip. In this study the Power Distribution Network (PDN) characteristics of this structure were analyzed in detail using 3-d electromagnetic modeling in order to evaluate the feasibility of this technology. The calculated PDN impedance of the interposer used in the previous study shows good agreement with the measured impedance. Then we introduce a generic modeling technique of PDN for large scale System on Chips (SoCs) and extensive parametric study was done to determine the optimized structure and parameters for power distribution of actual SoCs.
Keywords :
electronics packaging; high-k dielectric thin films; integrated circuit interconnections; system-on-chip; 3d electromagnetic modeling; PDN characteristics; PDN impedance; SoC; ground planes; high-dielectric ultra thin film; interposer; large scale system on chips; low impedance power distribution route; packaging technology; power distribution network characteristics; Capacitors; Impedance; Inductance; Packaging; Power distribution; Semiconductor device measurement; System-on-chip; capacitor; power distribution network; power integrity; system on chip;
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2014 IEEE
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-6194-8
DOI :
10.1109/ICSJ.2014.7009624
