Title :
Threshold value estimation of electrical interconnect tests with scan FFs
Author :
Nambara, Kousuke ; Umezu, Shoichi ; Yotsuyanagi, Hiroyuki ; Hashizume, Masaki ; Shyue-Kung Lu
Author_Institution :
Inst. of Tech. & Sci., Univ. of Tokushima, Tokushima, Japan
Abstract :
An estimation method of a threshold value for electrical interconnect tests is proposed for detecting open defects at interconnects between dies in a 3D IC. Threshold values of a circuit made of our prototyping IC on a printed circuit board are derived by the estimation method. The results show us that resistive open defects whose resistance is larger than 16.1Ω can be detected with a threshold value estimated by the method.
Keywords :
estimation theory; integrated circuit interconnections; integrated circuit testing; printed circuits; three-dimensional integrated circuits; 3D IC; dies; electrical interconnect tests; estimation method; printed circuit board; prototyping IC; resistive open defects; threshold value; Estimation; Integrated circuit interconnections; Resistance; Testing; Three-dimensional displays; Through-silicon vias; 3D IC; TSV; interconnect test; open defect;
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2014 IEEE
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-6194-8
DOI :
10.1109/ICSJ.2014.7009634
