DocumentCode
1798972
Title
I-m-Cave: An interactive tabletop system for virtually touring Mogao Caves
Author
Da-Yuan Huang ; Shen-Chi Chen ; Li-Erh Chang ; Po-Shiun Chen ; Yen-Ting Yeh ; Yi-Ping Hung
Author_Institution
Nat. Taiwan Univ., Taipei, Taiwan
fYear
2014
fDate
14-18 July 2014
Firstpage
1
Lastpage
6
Abstract
This paper presents i-m-Cave, a multitouch tabletop system for virtually touring the Mogao Caves. To recreate the experience of such a tour, a field study was conducted, and identified two key design considerations - exploration and restoration. For exploration, an innovative tangible figurine that can perform human-like neck extension/flexion is developed, and users can control the figurine to freely visit every corner of the virtual caves. Furthermore, users can view authorized animations to better understand the story behind important artifacts. With respect to restoration, users can restore digital artifacts and observe the rejuvenation and aging of artifacts with midair hand gestures and mobile devices, as if the users were shuttling back and forth between the present and the past. The i-m-Cave system presents the relationships between presently damaged artifacts and their virtually restored versions, which cannot be experienced in a real tour. Finally, the system was evaluated by interviewing experts. User feedback was positive, indicating the value of the system and its design.
Keywords
computer animation; graphical user interfaces; travel industry; virtual reality; I-m-Cave; Mogao caves; animation; digital artifact; exploration; human-like neck extension; innovative tangible figurine; interactive tabletop system; midair hand gesture; mobile device; multitouch tabletop system; restoration; virtual cave; virtual tour; Animation; Cameras; Image restoration; Multimedia communication; Neck; Tablet computers; Three-dimensional displays; Mogao Caves; figurine; tabletop interaction; virtual restoration; virtual tour;
fLanguage
English
Publisher
ieee
Conference_Titel
Multimedia and Expo (ICME), 2014 IEEE International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICME.2014.6890233
Filename
6890233
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