Title :
Wireless Test Structure for Integrated Systems
Author :
Noun, Z. ; Cauvet, P. ; Flottes, M.-L. ; Andreu, D. ; Bernara, S.
Author_Institution :
NXP Semicond., Caen
Abstract :
Contact-based wafer testing of complex integrated systems presents several drawbacks: inherent limitations in terms of pad pitch reduction and number of devices tested in parallel, eventual "touchdown" damage to the chip when recursive test is required. This paper presents a solution based on a wireless communication between the test equipment and the device under test.
Keywords :
integrated circuit testing; system-in-package; wafer level packaging; contact-based wafer testing; pad pitch reduction; recursive test; touchdown damage; wireless test structure; Control systems; Manufacturing; Multicast protocols; Probes; Semiconductor device testing; System testing; System-on-a-chip; Test equipment; Transceivers; Wireless communication;
Conference_Titel :
Test Conference, 2008. ITC 2008. IEEE International
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4244-2402-3
DOI :
10.1109/TEST.2008.4700704
