Title :
An integrated design approach for the hardware optimization of electrical power modules for automotive electrotraction
Author :
Wilde, Juergen ; Staiger, Wolfgang ; Thoben, Markus
Author_Institution :
Daimler Chrysler AG, Germany
Abstract :
In this paper, a systematic approach is presented for the design and optimization of forced liquid cooled electronic modules with high power dissipation. The steps of the design cycle include hydrodynamical evaluation of the heat sink, thermal management, thermomechanical optimization and especially lifetime prediction of soldered joints. Utilized engineering tools comprise computational fluid dynamics, finite differences and finite element programs. These are coupled via software interfaces in order to enable data exchange as well as efficient cooperation of the designers. Applying these means, performance, reliability and costs of a certain module have been optimized. By use of a design-for-reliability procedure substantial savings with regard to development time, prototyping effort and consequently costs can been achieved
Keywords :
cooling; electric vehicles; finite element analysis; heat sinks; power supplies to apparatus; thermal analysis; thermal management (packaging); traction; automotive electrotraction; computational fluid dynamics; cost savings; data exchange; design cycle; design-for-reliability procedure; development time; electrical power modules; finite differences; finite element programs; forced liquid cooled electronic modules; hardware optimization; heat sink; high power dissipation; hydrodynamical evaluation; integrated design approach; performance; prototyping effort; reliability; software interfaces; soldered joints; thermal management; thermomechanical optimization; Design optimization; Hardware; Heat sinks; Power dissipation; Power engineering and energy; Power system management; Reliability engineering; Thermal management; Thermal management of electronics; Thermomechanical processes;
Conference_Titel :
Vehicle Electronics Conference, 1999. (IVEC '99) Proceedings of the IEEE International
Conference_Location :
Changchun
Print_ISBN :
0-7803-5296-3
DOI :
10.1109/IVEC.1999.830655