Title :
Comparative analysis of various off-chip bus encoding techniques
Author :
Karthik, A. ; Yellampalli, Siva
Author_Institution :
VTU Ext. center, UTL Technol. Ltd., Bangalore, India
Abstract :
As the number of transistors in the chip has reached 2 billion, the power dissipation becomes the bottleneck in chip design, as power increases, the thermal dissipation also increases which in turn reduces the reliability of the chip and increases the packaging cost. Nowadays various power reduction techniques are adopted to target the power. Bus encoding technique is one among which reduces the dynamic power by reducing the switching activity in off chip wires. Various algorithms for bus encoding are proposed, this paper compares the different bus encoding scheme in terms of area, timing overhead and efficiency of power reduction and switching activity reduction.
Keywords :
CMOS logic circuits; chip scale packaging; integrated circuit interconnections; integrated circuit reliability; logic design; transistor circuits; bus encoding scheme; chip design; off-chip bus encoding techniques; off-chip wires; packaging cost; power dissipation; power reduction techniques; switching activity reduction; thermal dissipation; timing overhead; CMOS integrated circuits; Computers; Encoding; Hamming distance; Informatics; Power dissipation; Switches; Binary to Gray (B2G); Bus Inversion Encoder (BIE); Distributed Bus Inversion Encoder (DBIE); Middle Bit Reference (Mi Bit Ref); Modified Bit Reference (Mo Bit Ref); Most Significant Bit Reference (MSB Ref);
Conference_Titel :
Computer Communication and Informatics (ICCCI), 2015 International Conference on
Conference_Location :
Coimbatore
Print_ISBN :
978-1-4799-6804-6
DOI :
10.1109/ICCCI.2015.7218151