Title :
Differential equation model for a through hole via in multilayered microstrip circuits
Author :
Yaowu Liu ; Deshuang Zhao ; Mei, K.K.
Author_Institution :
Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, China
Abstract :
The analysis for a through hole via, which is used as a vertical interconnect line in multilayered microstrip circuits, is a challenge 3D problem. A simple distribution circuit is presented for modeling the non-TEM propagation characteristics of the through hole via for the first time. This model gives an excellent result, which is very close to the full-wave MoM simulation within a wide frequency bandwidth, while the speed of the differential equation is much faster than the MoM.
Keywords :
differential equations; method of moments; microstrip circuits; multilayers; radiowave propagation; differential equation model; distribution circuit; full-wave MoM; multilayered microstrip circuits; nonTEM propagation characteristics; through hole via; Coupling circuits; Difference equations; Differential equations; Finite difference methods; Frequency; Inductance; Lips; Maxwell equations; Microstrip; Time domain analysis;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2003. IEEE
Conference_Location :
Columbus, OH, USA
Print_ISBN :
0-7803-7846-6
DOI :
10.1109/APS.2003.1217525
