• DocumentCode
    1801829
  • Title

    Work in progress — Integrating semiconductor and nanotechnology fundamentals into a high school science curriculum module

  • Author

    Jackson, Michael A. ; Lewis, Elaine ; Fullerton, Daniel ; Kurinec, Santosh ; Rommel, Sean

  • Author_Institution
    Rochester Inst. of Technol., Rochester, NY, USA
  • fYear
    2010
  • fDate
    27-30 Oct. 2010
  • Abstract
    The Microelectronic Engineering Faculty at Rochester Institute of Technology have been engaged in two day K-12 Teacher forums addressing the engineering and fabrication of semiconductor devices for 12 years. A common theme that has emerged is the difficulty teachers have introducing new topics, such as those presented at the above-mentioned forums, to their students. It has become apparent to the Microelectronic Engineering faculty that a pre-developed curriculum requiring only teacher training would have the best chance of making a major impact. This paper reports on work in progress on a five week module designed to introduce semiconductor and nanotechnology fundamentals to AP physics students during the time after their AP exam in May and graduation in June. A major benefit of such a program would be introducing STEM students to exciting career opportunities.
  • Keywords
    educational courses; electronic engineering education; teacher training; K-12 teacher forums; high school science curriculum module; microelectronic engineering faculty; nanotechnology fundamentals; semiconductor device; semiconductor fundamentals; teacher training; work in progress; Conferences; Educational institutions; Integrated circuits; Materials; Microelectronics; Nanotechnology; Physics; H. S. Physics; K-12 Outreach; Microelectronics; Research Experience for Teachers (RET); STEM education;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frontiers in Education Conference (FIE), 2010 IEEE
  • Conference_Location
    Washington, DC
  • ISSN
    0190-5848
  • Print_ISBN
    978-1-4244-6261-2
  • Electronic_ISBN
    0190-5848
  • Type

    conf

  • DOI
    10.1109/FIE.2010.5673108
  • Filename
    5673108