Changes in mechanical properties of micron-sized single-crystal-silicon film at high temperature

Author

Nakao, Shigeki ; Ando, Taeko ; Shikida, Mitsuhiro ; Sato, Kazuo

Author_Institution

Dept. of Micro-Nano Syst. Eng., Nagoya Univ., Japan

Volume

2

fYear

2005

fDate

5-9 June 2005

Firstpage

1961

Abstract

The effects of temperature on the mechanical properties of micron-sized single-crystal-silicon (SCS) film were investigated using an "on-chip" tensile test. Young\´s modulus slightly decreased as the test temperature increased. The fracture stress decreased to 1.78 GPa at 773 K, the value is about 32 % of that at room temperature. The stress-strain relationship of SCS film at 773 K showed elastic-plastic deformation, and we observed crossed slip lines on the side surface of the fractured specimen. The fracture behavior of micron-sized silicon film changed in a temperature range from 673 K to 773 K.

Keywords

Young´s modulus; films; fracture toughness; fracture toughness testing; high-temperature effects; silicon; tensile strength; tensile testing; 673 to 773 K; Young modulus; elastic-plastic deformation; fracture behavior; fracture strength; mechanical properties; micron sized; on-chip tensile test; single crystal silicon film; Bars; Force measurement; Materials testing; Mechanical factors; Microelectromechanical devices; Micromechanical devices; Semiconductor materials; Strain measurement; Temperature; Tensile stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on

Print_ISBN

0-7803-8994-8

Type

conf

DOI

10.1109/SENSOR.2005.1497484

Filename

1497484