• DocumentCode
    1803
  • Title

    CPIC: A Curvilinear Particle-in-Cell Code for Plasma–Material Interaction Studies

  • Author

    Delzanno, G.L. ; Camporeale, Enrico ; Moulton, J. David ; Borovsky, Joseph E. ; MacDonald, Elizabeth A. ; Thomsen, Michelle F.

  • Author_Institution
    T-5 Appl. Math. & Plasma Phys. Group, Los Alamos Nat. Lab., Los Alamos, NM, USA
  • Volume
    41
  • Issue
    12
  • fYear
    2013
  • fDate
    Dec. 2013
  • Firstpage
    3577
  • Lastpage
    3587
  • Abstract
    We describe a new electrostatic particle-in-cell (PIC) code in curvilinear geometry called curvilinear PIC (CPIC). The code models the microscopic (kinetic) evolution of a plasma with the PIC method, coupled with an adaptive computational grid that can conform to arbitrarily shaped domains. CPIC is particularly suited for multiscale problems associated with the interaction of complex objects with plasmas. A map is introduced between the physical space and the logical space, where the grid is uniform and Cartesian. In CPIC, most of the operations are performed in logical space. CPIC was designed following criteria of versatility, robustness, and performance. Its main features are the use of structured meshes, a scalable field solver based on the black box multigrid algorithm and a hybrid mover, where particles´ position is in logical space while the velocity is in physical space. Test examples involving the interaction of a plasma with material boundaries are presented.
  • Keywords
    plasma kinetic theory; plasma simulation; plasma-wall interactions; CPIC; arbitrarily shaped domains; computational grid; curvilinear particle-in-cell code; electrostatic particle-in-cell code; logical space; microscopic evolution; multigrid algorithm; plasma-material interaction; structured meshes; Geometry; Interpolation; Jacobian matrices; Measurement; Plasmas; Robustness; Space vehicles; Simulation software; spacecraft charging;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/TPS.2013.2290060
  • Filename
    6675865