Surface-micromachined millimeter-wave antennas

Author

Yoon, Yong-Kyu ; Pan, Bo ; Papapolymerou, John ; Tentzeris, Manos ; Allen, Mark G.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

2

fYear

2005

fDate

5-9 June 2005

Firstpage

1986

Abstract

This paper reports various three-dimensional (3-D) surface micromachining technologies and their successful application to a variety of millimeter-wave antennas. Contrary to conventional planar type printed-circuit antenna structures, the 3-D surface micromachined structures described here minimize substrate effects, enabling substrate independence, high electrical performance, and broad bandwidth. The key technologies exploited include epoxy-core conductor technology, magnetic assembly, and electroplating bonding technology. Four millimeter-wave vehicles illustrate the technology: a monopole-driven Yagi-Uda (M-Yagi) antenna; an air-lifted patch antenna; an air-lifted coupler; and an air-lifted monopole antenna.

Keywords

Yagi antenna arrays; electroplating; micromachining; micromechanical devices; millimetre wave antenna arrays; monopole antenna arrays; 3D surface micromachining; air lifted coupler; air lifted monopole antenna; air lifted patch antenna; broad band antenna; electroplating bonding; magnetic assembly; monopole-driven Yagi-Uda antenna; substrate effects; surface micromachined millimeter wave antennas; Assembly; Bandwidth; Bonding; Conductors; Dielectric substrates; Dipole antennas; Millimeter wave communication; Millimeter wave radar; Millimeter wave technology; Patch antennas;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on

Print_ISBN

0-7803-8994-8

Type

conf

DOI

10.1109/SENSOR.2005.1497490

Filename

1497490