Title :
Control the shape and curvature of micromachined cantilever using multiple plasma chemistry bonding technology
Author :
Su, Wang-Shen ; Lee, Sheng-Ta ; Lin, Cheng-Yu ; Fang, Weileun ; Tsai, Ming-Shih
Author_Institution :
MEMS Inst., National Tsing-Hua Univ., Hsinchu, Taiwan
Abstract :
This study reports a novel method for tuning the deflection profile of micromachined cantilever by means of multiple plasma surface modification. In short, the shape and curvature of the cantilever can be tuned using the combination of plasma treatments along the beam length and the beam width, respectively. To demonstrate the feasibility of this approach, various NH3 plasma treatments were employed to tune the deflection profile of cantilevers made of SiO2 film. The deflection profiles predicted by the simulation and analysis agree with that determined from measurement.
Keywords :
beams (structures); bonding processes; internal stresses; micromachining; plasma chemistry; shape control; silicon compounds; thin films; SiO2; beam length; beam width; curvature control; deflection profile tuning; micromachined cantilever; multiple plasma chemistry bonding technology; shape control; surface modification; Analytical models; Bonding; Chemical technology; Particle beams; Plasma chemistry; Plasma measurements; Plasma simulation; Shape control; Structural beams; Surface treatment;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
Print_ISBN :
0-7803-8994-8
DOI :
10.1109/SENSOR.2005.1497498