• DocumentCode
    1803333
  • Title

    Micro-tensile device and test for micro-wire in MEMS

  • Author

    Bai, Qingshun ; He, Bin ; Liang, Yingchun ; Cheng, Kai

  • Author_Institution
    Sch. of Mech. & Electr. Eng., Harbin Inst. of Technol., Harbin, China
  • fYear
    2012
  • fDate
    7-8 Sept. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Micro components and structures used in MEMS play a functionalized role for the typical application. Micro-wire is often used in the kinds of MEMS area, such as micro-fabrication, micro-assembly, and micro-packaging. The mechanical property of micro-wire can greatly influence its final function. Because of the physical tiny diameter for micro-wire, it is quite difficult for testing the mechanics properties. A new developed micro-tensile device based on piezoelectric actuator was presented in this paper. Key elements for the micro-tensile was introduced and analyzed in terms of the function and stiffness. With the developed micro-tensile device, copper micro wire with a micro notch was tested concerning the validation of the device. The morphologies for the tensile copper wire specimen were also analyzed by the imaging sub-system and scanning electron microscope (SEM). It is shown that the plastic deformation and micro-crack contribute to the break of copper micro-wire. The tensile test validated the implementation of micro-tensile device.
  • Keywords
    copper; microfabrication; piezoelectric actuators; scanning electron microscopy; tensile testing; wires (electric); MEMS; SEM; mechanics properties; microassembly; microcrack; microfabrication; micronotch; micropackaging; microtensile device; microwire mechanical property; piezoelectric actuator; plastic deformation; scanning electron microscope; tensile copper wire specimen; tensile test; Actuators; Connectors; Copper; Joints; Micromechanical devices; Scanning electron microscopy; Testing; micro-wire; piezoelectric actuator; tensile test;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Automation and Computing (ICAC), 2012 18th International Conference on
  • Conference_Location
    Loughborough
  • Print_ISBN
    978-1-4673-1722-1
  • Type

    conf

  • Filename
    6330537