• DocumentCode
    1803424
  • Title

    A feedforward neural networks (FNN) used for semiconductor wafer fabrication parameters optimization

  • Author

    Yongmei, Chen ; Xiangdong, Wang ; Shoujue, Wang ; Linchu, Shi

  • Author_Institution
    Beijing, China
  • Volume
    6
  • fYear
    1999
  • fDate
    36342
  • Firstpage
    3922
  • Abstract
    Semiconductor wafer fabrication process is a dynamic, very complex and multiphase system. The wafer performance is determined by so many factors in manufacturing process that it is very difficult to model the whole process with a statistical method. In this paper, an effective optimization strategy of the semiconductor manufacturing process is implemented. This method is based on a feedforward neural network (FNN), which uses a Gaussian function as the activation function of its hidden units and sigmoid as that of output unit. By training with samples collected from historical technological record, the static FNN model is built to fit the wafer fabrication process. Then some newer samples collected from the latest manufacturing lots are fed to retrain the network. During this retrain process, some “bad” or noisy samples are replaced by the new ones, a dynamic FNN model is built so that the trained network would fit the actual manufacturing process better and closely
  • Keywords
    feedforward neural nets; integrated circuit manufacture; optimisation; transfer functions; FNN; Gaussian function; activation function; feedforward neural network; noisy samples; semiconductor manufacturing process; semiconductor wafer fabrication parameters optimization; Educational institutions; Etching; Fabrication; Feedforward neural networks; Manufacturing processes; Neural networks; Plasma applications; Predictive models; Semiconductor device modeling; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Neural Networks, 1999. IJCNN '99. International Joint Conference on
  • Conference_Location
    Washington, DC
  • ISSN
    1098-7576
  • Print_ISBN
    0-7803-5529-6
  • Type

    conf

  • DOI
    10.1109/IJCNN.1999.830783
  • Filename
    830783