DocumentCode :
1803814
Title :
A hybrid electrical-behavioral modeling approach for pre- and post-silicon electrical validation
Author :
Hakim, N.Z. ; Bhaduri, A. ; Donepudi, K. ; Bodapati, S.
Author_Institution :
Intel Corp., Santa Clara, CA, USA
fYear :
2012
fDate :
9-12 Sept. 2012
Firstpage :
1
Lastpage :
5
Abstract :
This paper discusses pre- and post-silicon electrical validation requirements for highly integrated designs and highlights the need for large-scale modeling and simulation of analog components in the context of validation. Current fast SPICE tools and Analog-Mixed Signal simulation do not provide the speed and scalability necessary to perform full cluster or system-level verification of high-speed IO links or to perform a variability analysis of these circuits. This paper outlines a method to scale the simulation of these circuits with correct accounting of voltage and temperature fluctuations, within-die and die-to-die variations, and platform uncertainty, with little loss in accuracy. The results are illustrated on a self-biased PLL example and illustrate the tremendous speedup that can be achieved while maintaining a comparable accuracy to SPICE for the behaviors that are modeled.
Keywords :
circuit simulation; integrated circuit design; integrated circuit modelling; analog component modeling; analog component simulation; circuit simulation; die-to-die variation; hybrid electrical-behavioral modeling approach; integrated design; platform uncertainty; post-silicon electrical validation; presilicon electrical validation; system-level verification; temperature fluctuation; variability analysis; voltage fluctuation; within-die variation; Accuracy; Analog circuits; Circuit simulation; Hardware design languages; Integrated circuit modeling; Phase locked loops; Sensitivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference (CICC), 2012 IEEE
Conference_Location :
San Jose, CA
ISSN :
0886-5930
Print_ISBN :
978-1-4673-1555-5
Electronic_ISBN :
0886-5930
Type :
conf
DOI :
10.1109/CICC.2012.6330559
Filename :
6330559
Link To Document :
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