• DocumentCode
    1803814
  • Title

    A hybrid electrical-behavioral modeling approach for pre- and post-silicon electrical validation

  • Author

    Hakim, N.Z. ; Bhaduri, A. ; Donepudi, K. ; Bodapati, S.

  • Author_Institution
    Intel Corp., Santa Clara, CA, USA
  • fYear
    2012
  • fDate
    9-12 Sept. 2012
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    This paper discusses pre- and post-silicon electrical validation requirements for highly integrated designs and highlights the need for large-scale modeling and simulation of analog components in the context of validation. Current fast SPICE tools and Analog-Mixed Signal simulation do not provide the speed and scalability necessary to perform full cluster or system-level verification of high-speed IO links or to perform a variability analysis of these circuits. This paper outlines a method to scale the simulation of these circuits with correct accounting of voltage and temperature fluctuations, within-die and die-to-die variations, and platform uncertainty, with little loss in accuracy. The results are illustrated on a self-biased PLL example and illustrate the tremendous speedup that can be achieved while maintaining a comparable accuracy to SPICE for the behaviors that are modeled.
  • Keywords
    circuit simulation; integrated circuit design; integrated circuit modelling; analog component modeling; analog component simulation; circuit simulation; die-to-die variation; hybrid electrical-behavioral modeling approach; integrated design; platform uncertainty; post-silicon electrical validation; presilicon electrical validation; system-level verification; temperature fluctuation; variability analysis; voltage fluctuation; within-die variation; Accuracy; Analog circuits; Circuit simulation; Hardware design languages; Integrated circuit modeling; Phase locked loops; Sensitivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference (CICC), 2012 IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    0886-5930
  • Print_ISBN
    978-1-4673-1555-5
  • Electronic_ISBN
    0886-5930
  • Type

    conf

  • DOI
    10.1109/CICC.2012.6330559
  • Filename
    6330559