DocumentCode :
1804528
Title :
Advances in 3D design and optimization
Author :
Wilton, Steve ; Sathe, Visvesh
Author_Institution :
University of British Columbia
fYear :
2012
fDate :
9-12 Sept. 2012
Firstpage :
1
Lastpage :
1
Abstract :
Recent years have seen the emergence of 3D integration technology. This technology promises significant improvements in cost, capacity, bandwidth and power. The papers in this session will describe three diverse ways of leveraging the third dimension: silicon-interposer based 3D integration, stacked die using a fine-grained standard-cell design style, and the use of a wireless inductive link for supplying power to individual die. Together, these papers provide a snapshot of the current state-of-the-art in 3D integration.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference (CICC), 2012 IEEE
Conference_Location :
San Jose, CA, USA
ISSN :
0886-5930
Print_ISBN :
978-1-4673-1555-5
Electronic_ISBN :
0886-5930
Type :
conf
DOI :
10.1109/CICC.2012.6330587
Filename :
6330587
Link To Document :
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