Title :
Advances in 3D design and optimization
Author :
Wilton, Steve ; Sathe, Visvesh
Author_Institution :
University of British Columbia
Abstract :
Recent years have seen the emergence of 3D integration technology. This technology promises significant improvements in cost, capacity, bandwidth and power. The papers in this session will describe three diverse ways of leveraging the third dimension: silicon-interposer based 3D integration, stacked die using a fine-grained standard-cell design style, and the use of a wireless inductive link for supplying power to individual die. Together, these papers provide a snapshot of the current state-of-the-art in 3D integration.
Conference_Titel :
Custom Integrated Circuits Conference (CICC), 2012 IEEE
Conference_Location :
San Jose, CA, USA
Print_ISBN :
978-1-4673-1555-5
Electronic_ISBN :
0886-5930
DOI :
10.1109/CICC.2012.6330587
