Advances in 3D design and optimization

Recent years have seen the emergence of 3D integration technology. This technology promises significant improvements in cost, capacity, bandwidth and power. The papers in this session will describe three diverse ways of leveraging the third dimension: silicon-interposer based 3D integration, stacked die using a fine-grained standard-cell design style, and the use of a wireless inductive link for supplying power to individual die. Together, these papers provide a snapshot of the current state-of-the-art in 3D integration.