Title :
0.61W/mm2 resonant inductively coupled power transfer for 3D-ICs
Author :
Han, Sangwook ; Wentzloff, David D.
Author_Institution :
Univ. of Michigan, Ann Arbor, MI, USA
Abstract :
A high power density wireless inductive power link targeting 3D-ICs and wireless testing is implemented in 65nm CMOS. Its operating frequency is 3.5GHz, the optimal frequency from the trade-off between delivered power and power loss. The link exploits high-Q inductors and resonant inductive coupling to boost the received voltage and maximize the delivered power. A power density of 0.61W/mm2 is achieved with 0.12×0.12mm2 coils and a 50μm separation.
Keywords :
CMOS integrated circuits; inductive power transmission; inductors; three-dimensional integrated circuits; 3D-IC; CMOS process; coils; frequency 3.5 GHz; high power density wireless inductive power link; high-Q inductors; power density; power loss; resonant inductive coupling; resonant inductively coupled power transfer; size 50 mum; size 65 nm; Coils; Couplings; Rectifiers; Resonant frequency; Transmitters; Wireless communication; Wireless sensor networks;
Conference_Titel :
Custom Integrated Circuits Conference (CICC), 2012 IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4673-1555-5
Electronic_ISBN :
0886-5930
DOI :
10.1109/CICC.2012.6330590
