• DocumentCode
    1805361
  • Title

    Wire sizing optimization for buffered global interconnects

  • Author

    Tang, Min ; Mao, Junfa

  • Author_Institution
    Dept. of Electron. Eng., Shanghai Jiao Tong Univ., Shanghai
  • Volume
    2
  • fYear
    2008
  • fDate
    21-24 April 2008
  • Firstpage
    479
  • Lastpage
    482
  • Abstract
    This paper presents a novel methodology to achieve the optimal wire sizing of buffered global interconnects. Based on the model of optimal repeater insertion, the impact of the line width and spacing on performance, such as delay, power dissipation and area, is investigated. The power-delay product is therefore defined as a figure of merit (FOM). An analytical expression for the optimal line width is presented. The effects of the weight factor and constrained coefficient on performance are investigated and some useful guidelines for wire sizing of global interconnects are proposed.
  • Keywords
    circuit optimisation; integrated circuit interconnections; buffered global interconnects; figure of merit; optimal line width; optimal repeater insertion; optimal wire sizing; power dissipation; power-delay product; wire sizing optimization; Capacitance; Constraint optimization; Delay; Dielectrics; Guidelines; Integrated circuit interconnections; Optimization methods; Power dissipation; Repeaters; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave and Millimeter Wave Technology, 2008. ICMMT 2008. International Conference on
  • Conference_Location
    Nanjing
  • Print_ISBN
    978-1-4244-1879-4
  • Electronic_ISBN
    978-1-4244-1880-0
  • Type

    conf

  • DOI
    10.1109/ICMMT.2008.4540430
  • Filename
    4540430