A novel power plane structure for EMC design for modern system in package

The design of power distribution network to deliver noise free power to high performance systems of increasing package density, high clock speed, high power demand at low voltages, and large current change with fast slew-rate is a challenging task. This paper describes a novel power-ground plane design with low power supply noise, low radiation for modern system in package. We design this novel structure according to a kind of plant leaf nutrient delivering system because we think it works in the best way in nature. We wish deliver the direct current to each circuit element as the leaf delivers the nutrient with the least resistance. The designed power-ground plane structure consists of a power plane with perforation (top), and a ground plane (bottom). The size of the perforation is far below the wavelength in order that the existence of the perforated opening on the power planes contributes less to the radiation of the whole structure. There is good agreement between the numerical prediction method and measurement results. The measured S₂₁ is below -10 dB and SSN (simultaneous switching noise) cannot deliver into chip power system. The solders increase the DC resistance 2.7% for the novel structure power plane-ground plane and 18.68% for traditional structure. The Swiss-Chess structure effect (high resistance metal areas because of distributed via and solders and leading to the voltages or currents to the circuit-elements lower than design demand) is reduced. The simulated gain shows there is no antenna effect for our designed power-ground plane.