• DocumentCode
    1805696
  • Title

    Interoperating Simulations of Automatic Material Handling Systems and Manufacturing Processes

  • Author

    Gan, Boon Ping ; Chan, Lai Peng ; Turner, Stephen John

  • Author_Institution
    Planning & Oper. Manage. Group, Singapore Inst. of Manuf. Technol.
  • fYear
    2006
  • fDate
    3-6 Dec. 2006
  • Firstpage
    1129
  • Lastpage
    1135
  • Abstract
    To perform a high fidelity simulation study on a 300 mm wafer fabrication plant, modeling of the manufacturing process (MP) alone is not sufficient. Inclusion of the automated material handling system (AMHS) model is necessary due to the high degree of factory automation. There isn´t, however, a single tool that is capable of modeling both the AMHS and MP with sufficient accuracy and granularity. A commercial simulation package such as AutoMod is usually used to model the AMHS while AutoSched AP is usually used to model the MP. These packages can be integrated using the supplied interoperation module but flexibility in optimizing the execution performance for different simulation models is lacking. In this paper, we present an approach to interoperation based on the high level architecture standard. We note that the typical characteristics of disparity in the models´ time granularity and frequent model interactions are the obstacle to good execution performance
  • Keywords
    digital simulation; manufacturing systems; materials handling; open systems; semiconductor device manufacture; AutoMod; AutoSched AP; automatic material handling systems; high level architecture; interoperating simulations; manufacturing processes; Computational modeling; Discrete event simulation; Gallium nitride; Manufacturing automation; Manufacturing processes; Materials handling; Middleware; Packaging; Semiconductor device manufacture; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference, 2006. WSC 06. Proceedings of the Winter
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    1-4244-0500-9
  • Electronic_ISBN
    1-4244-0501-7
  • Type

    conf

  • DOI
    10.1109/WSC.2006.323203
  • Filename
    4117727