Probing and irradiation tests of ALICE pixel chip wafers and sensors

Author

Cinausero, M. ; Fioretto, E. ; Antinori, F. ; Chochula, P. ; Dinapoli, R. ; Dima, R. ; Fabris, D. ; Galet, G. ; Lunardon, M. ; Manea, C. ; Marchini, S. ; Martini, S. ; Moretto, S. ; Pepato, A. ; Prete, G. ; Riedler, P. ; Scarlassara, F. ; Segato, G. ; Sor

Author_Institution

Lab. Nazionali di Legnaro, Ist. Nazionale di Fisica Nucl., Legnaro, Italy

Volume

3

fYear

2004

fDate

18-20 May 2004

Firstpage

1823

Abstract

In the framework of the ALICE Silicon Pixel Detector (SPD) project a system dedicated to the tests of the ALICE1LHCb chip wafers has been assembled and is now in use for the selection of pixel chips to be bump-bonded to sensor ladders. In parallel, radiation hardness tests of the SPD silicon sensors have been carried out using the 27 MeV proton beam delivered by the XTU TANDEM accelerator at the SIRAD facility in LNL. In this paper we describe the wafer probing and irradiation set-ups and we report the obtained results.

Keywords

CMOS integrated circuits; annealing; leakage currents; mixed analogue-digital integrated circuits; proton effects; radiation hardening (electronics); readout electronics; silicon radiation detectors; 27 MeV; ALICE silicon pixel detector; ALICE1LHCb chip wafers; CERN Large Hadron Collider; CMOS process; Si; annealing process; bump-bonded; chip readout; depletion bias; irradiation damage; irradiation tests; leakage current; mixed-signal chip; radiation hardness tests; sensor ladders; wafer probing; Collaboration; Detectors; Diodes; Heating; Large Hadron Collider; Neutrons; Particle tracking; Protons; Silicon; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Instrumentation and Measurement Technology Conference, 2004. IMTC 04. Proceedings of the 21st IEEE

ISSN

1091-5281

Print_ISBN

0-7803-8248-X

Type

conf

DOI

10.1109/IMTC.2004.1351437

Filename

1351437