• DocumentCode
    1806524
  • Title

    An electrical model of a NPT-IGBT including transient temperature effects realized with PSpice device equations modeling

  • Author

    Apeldoorn, O. ; Schmitt, S. ; De Doncker, R.W.

  • Author_Institution
    Inst. for Power Electron. & Electr. Drives, Tech. Hochschule Aachen, Germany
  • Volume
    2
  • fYear
    1997
  • fDate
    7-11 Jul 1997
  • Firstpage
    223
  • Abstract
    To describe the electrical and thermal behaviour of an insulated gate bipolar transistor (IGBT) for circuit simulation, an analytical model is designed. The model uses a charge-control approach according to the HEFNER model. The effect of the transient chip-temperature on different physical parameters is defined by the thermal model. The numerical realization is made on the basis of nodal analysis and a linearization according to the Newton-Raphson method. All equations are implemented in C-code and combined with the simulator source code, using the PSpice device equation option. As a result, an internal model is created. Due to the thermal network, the IGBT has become a four terminal device. It can be applied to various thermal and electrical circuit topologies. A transient simulation of the device temperature allows short circuit or overload conditions to be studied in detail
  • Keywords
    Newton-Raphson method; SPICE; circuit analysis computing; insulated gate bipolar transistors; linearisation techniques; power bipolar transistors; semiconductor device models; software packages; thermal analysis; C code; HEFNER model; NPT-IGBT; Newton-Raphson method; PSpice; charge-control approach; circuit simulation; computer simulation; device equations modeling; linearization; nodal analysis; non-punch-through IGBT; overload conditions; power insulated gate bipolar transistor; short-circuit conditions; transient simulation; transient temperature effects; Analytical models; Anodes; Charge carrier processes; Circuit simulation; Equations; Insulated gate bipolar transistors; MOSFET circuits; SPICE; Temperature; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, 1997. ISIE '97., Proceedings of the IEEE International Symposium on
  • Conference_Location
    Guimaraes
  • Print_ISBN
    0-7803-3936-3
  • Type

    conf

  • DOI
    10.1109/ISIE.1997.648939
  • Filename
    648939