Title :
A 60GHz on-chip RF-Interconnect with λ/4 coupler for 5Gbps bi-directional communication and multi-drop arbitration
Author :
Wu, Hao ; Nan, Lan ; Tam, Sai-Wang ; Hsieh, Hsieh-Hung ; Jou, Chewpu ; Reinman, Glenn ; Cong, Jason ; Chang, Mau-Chung Frank
Author_Institution :
Univ. of California, Los Angeles, CA, USA
Abstract :
A 5Gbps bi-directional RF-Interconnect (RF-I) with multi-drop and arbitration capabilities is designed and realized in 65nm CMOS. The baseband data are modulated in RF-I by using a 60GHz carrier in ASK format. An on-chip differential transmission line (TL) is used as the communication channel, which minimizes the latency (9ps/mm) only under the speed-of-light limitation. We insert λ/4 directional couplers for implementing multi-drops without signal reflection. We also use MOS switches along the signal path to reconfigure/arbitrate communication priority for multi-drops. This design consists of four TX/RX drops along a 5.5mm TL ring, supports destructive reading with fixed priority, and can reconfigure any drop as the transmitter. The tested data rate of the RF-I is 5Gbps with lower than 10-12 BER. The average power consumptions for the link are 1.33pJ/b and 0.24pJ/b/mm.
Keywords :
CMOS integrated circuits; directional couplers; error statistics; integrated circuit interconnections; network-on-chip; λ/4 directional coupler; ASK format; BER; CMOS; MOS switches; bidirectional RF-Interconnect; bidirectional communication; bit rate 5 Gbit/s; frequency 60 GHz; multidrop arbitration; on-chip RF-interconnect; on-chip differential transmission line; power consumption; size 65 nm; Amplitude shift keying; Bandwidth; Directional couplers; Integrated circuit interconnections; Reflection; System-on-a-chip; Transmitters;
Conference_Titel :
Custom Integrated Circuits Conference (CICC), 2012 IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4673-1555-5
Electronic_ISBN :
0886-5930
DOI :
10.1109/CICC.2012.6330666
