Study of interaction between the function of grit size and residual damage of an ultra thin wafer

Wafer thinning operation parameters such as grit size of grinding wheel, spindle speed, grinding chuck rotation speed, feed rate, grinding tape material, and wafer handling mechanism become more critical as the market is driving thinner wafers. The input parameter of the thinning process control the surface roughness and the residual damage. In this study, the relationship between grits size and surface roughness was investigated using UBM Laser-Profilometer. Warpage was measured at different temperatures using Infrared Fizeau Interferometry. It was shown that bigger grit causes higher surface roughness and surface roughness is directly related with surface damage, stress and warpage.