Title :
Design solutions for 3D integration and signal integrity
Author :
Cao, Yu ; Mudanai, Siva
Author_Institution :
Arizona State University
Abstract :
Design robustness is increasingly challenging in large-scale system integration. This session presents solutions to 3D integration, ESD, and on-chip interconnect.
Conference_Titel :
Custom Integrated Circuits Conference (CICC), 2012 IEEE
Conference_Location :
San Jose, CA, USA
Print_ISBN :
978-1-4673-1555-5
Electronic_ISBN :
0886-5930
DOI :
10.1109/CICC.2012.6330687
