• DocumentCode
    1807823
  • Title

    Pareto Control in Multi-Objective Dynamic Scheduling of a Stepper Machine in Semiconductor Wafer Fabrication

  • Author

    Gupta, Amit Kumar ; Sivakumar, Appa Iyer

  • Author_Institution
    Planning & Oper. Manage. Group, Singapore Inst. of Manuf. Technol., Nanyang
  • fYear
    2006
  • fDate
    3-6 Dec. 2006
  • Firstpage
    1749
  • Lastpage
    1756
  • Abstract
    This paper focuses on Pareto control in multi-objective dynamic scheduling of a stepper machine that is considered as a bottleneck machine in the semiconductor wafer fabrication process. We propose the use of compromise programming method for achieving Pareto control in the needs of conflicting objectives such as mean cycle time, cycle time variance and maximum tardiness. Using conjunctive simulated scheduling, at each decision instance in simulated time, a Pareto job is selected and loaded on the machine for processing. Using the real factory data, we demonstrate the concept of Pareto control in dynamic scheduling and show how a stepper machine can be controlled at specified needs of scheduling objectives. The results obtained from Pareto control approach are superior to the simulated results of actual operating heuristic in the factory
  • Keywords
    Pareto analysis; dynamic scheduling; integrated circuit manufacture; Pareto control; conjunctive simulated scheduling; cycle time variance; maximum tardiness; mean cycle time; multi-objective dynamic scheduling; semiconductor wafer fabrication; stepper machine; Dynamic scheduling; Electronics industry; Fabrication; Job shop scheduling; Manufacturing processes; Process planning; Production facilities; Semiconductor device manufacture; Single machine scheduling; Technology planning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference, 2006. WSC 06. Proceedings of the Winter
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    1-4244-0500-9
  • Electronic_ISBN
    1-4244-0501-7
  • Type

    conf

  • DOI
    10.1109/WSC.2006.322951
  • Filename
    4117809