• DocumentCode
    1807849
  • Title

    A fully-integrated Ka-band stacked power amplifier in 45nm CMOS SOI technology

  • Author

    Jing-Hwa Chen ; Helmi, S.R. ; Mohammadi, Soheil

  • Author_Institution
    Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • fYear
    2013
  • fDate
    21-23 Jan. 2013
  • Firstpage
    75
  • Lastpage
    77
  • Abstract
    A fully-integrated Ka-band power amplifier (PA) designed with 2 stacked Cascode cells is implemented in 45nm CMOS SOI technology. The stack configuration overcomes the low breakdown voltages of scaled transistors and provides an output impedance close to 50 Ω. At 37 GHz, and when biased at 3.6 V, the PA delivers a saturated output power (PSAT) and a -1dB compressed output power (P1dB) of 20.2 dBm and 14.5 dBm, respectively, with a peak PAE of 11.2%. With a higher supply voltage of 4.4 V (1.1 V across each transistor), the PSAT and P1dB increase to 21.4 dBm (140 mW) and 17.5 dBm, respectively. The stack configuration allows the PA to deliver high output power at mm-wave frequencies despite the fact that each transistor is biased under a low drain-source voltage.
  • Keywords
    CMOS analogue integrated circuits; MOSFET; electric breakdown; elemental semiconductors; field effect MIMIC; millimetre wave field effect transistors; millimetre wave integrated circuits; millimetre wave power amplifiers; scaling circuits; silicon; silicon-on-insulator; 2 stacked cascode cell; CMOS SOI technology; PA; PAE; Si; breakdown voltage; compressed output power; efficiency 11.2 percent; frequency 37 GHz; fully-integrated Ka-band stacked power amplifier; gain -1 dB; low drain-source voltage; output impedance; power 140 mW; saturated output power; size 45 nm; transistor scaling; voltage 1.1 V; voltage 3.6 V; voltage 4.4 V; CMOS integrated circuits; CMOS technology; Impedance; Power amplifiers; Power generation; Transistors; Voltage measurement; CMOS; Ka-band; SOI; mm-wave frequencies; stacked power amplifier;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Silicon Monolithic Integrated Circuits in RF Systems (SiRF), 2013 IEEE 13th Topical Meeting on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4673-1552-4
  • Electronic_ISBN
    978-1-4673-1551-7
  • Type

    conf

  • DOI
    10.1109/SiRF.2013.6489437
  • Filename
    6489437