Title :
Investigation and elimination of discolored bondpads on microchip
Author :
Younan, Hua ; Eddy, Chee ; Redkar, Shailesh
Author_Institution :
Chartered Semicond. Manuf. Ltd., Singapore, Singapore
Abstract :
In this paper, a case of discolored bondpad is discussed. Failure analysis results showed the discoloration of bondpads was due to pinholes and Si dust around the pinholes. which were introduced during the wafer die sawing process caused by galvanic corrosion. Failure mechanism and characteristics of galvanic corrosion on Aluminium bondpads have been studied in this paper.
Keywords :
aluminium alloys; chip scale packaging; corrosion; failure analysis; microassembling; wafer bonding; AlCuSi; Si dust; aluminium bondpads; discolored bondpads; failure analysis; galvanic corrosion; microchip; pinholes; wafer die sawing; Anodes; Assembly; Cathodes; Corrosion; Failure analysis; Galvanizing; Inspection; Numerical analysis; Sawing; Wafer bonding;
Conference_Titel :
Semiconductor Electronics, 2002. Proceedings. ICSE 2002. IEEE International Conference on
Print_ISBN :
0-7803-7578-5
DOI :
10.1109/SMELEC.2002.1217847
