DocumentCode
1807880
Title
Investigation and elimination of discolored bondpads on microchip
Author
Younan, Hua ; Eddy, Chee ; Redkar, Shailesh
Author_Institution
Chartered Semicond. Manuf. Ltd., Singapore, Singapore
fYear
2002
fDate
19-21 Dec. 2002
Firstpage
383
Lastpage
387
Abstract
In this paper, a case of discolored bondpad is discussed. Failure analysis results showed the discoloration of bondpads was due to pinholes and Si dust around the pinholes. which were introduced during the wafer die sawing process caused by galvanic corrosion. Failure mechanism and characteristics of galvanic corrosion on Aluminium bondpads have been studied in this paper.
Keywords
aluminium alloys; chip scale packaging; corrosion; failure analysis; microassembling; wafer bonding; AlCuSi; Si dust; aluminium bondpads; discolored bondpads; failure analysis; galvanic corrosion; microchip; pinholes; wafer die sawing; Anodes; Assembly; Cathodes; Corrosion; Failure analysis; Galvanizing; Inspection; Numerical analysis; Sawing; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2002. Proceedings. ICSE 2002. IEEE International Conference on
Print_ISBN
0-7803-7578-5
Type
conf
DOI
10.1109/SMELEC.2002.1217847
Filename
1217847
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