• DocumentCode
    1808606
  • Title

    Embedded Toolkits for User Co-Design: A Technology Acceptance Study of Product Adaptability in the Usage Stage

  • Author

    Piller, Frank ; Ihl, Christoph ; Steiner, Frank

  • Author_Institution
    RWTH Aachen Univ., Aachen, Germany
  • fYear
    2010
  • fDate
    5-8 Jan. 2010
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    Recent reviews show large failure rates in the commercialization of new product designs. Often, the reason of failure has been not a lack of technological capability of the firm, but a wrong understanding of customer preferences. Extending the concept of adaptable smart products, our concept of "embedded toolkits for user co-design" proposes to design products with build-in flexibility by embedding knowledge and rules about possible product differentiations into the product. This approach can be seen as a scalable attempt towards "open hardware", extending the open innovation paradigm beyond software towards tangible products. Users are enabled to modify a product directly according to their individual needs. We present a technology acceptance study (TAM) of such an embedded toolkit in an automobile. Surveying 163 users demonstrates the general feasibility and value drivers of embedded toolkits. Our paper contributes to the literature by discussing the contingency factors and the tactical and strategic implications of embedded open toolkits for user innovation.
  • Keywords
    automobile industry; embedded systems; product design; production engineering computing; embedded open toolkits; embedded toolkits; open innovation paradigm; product adaptability; product designs; tangible products; technology acceptance model; user codesign; user innovation; Automobiles; Commercialization; Hardware; Manufacturing industries; Market research; Product design; Product development; Refining; Technological innovation; Uncertainty;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System Sciences (HICSS), 2010 43rd Hawaii International Conference on
  • Conference_Location
    Honolulu, HI
  • ISSN
    1530-1605
  • Print_ISBN
    978-1-4244-5509-6
  • Electronic_ISBN
    1530-1605
  • Type

    conf

  • DOI
    10.1109/HICSS.2010.178
  • Filename
    5428750