• DocumentCode
    180912
  • Title

    Exploit Dynamic Voltage and Frequency Scaling for SoC Test Scheduling under Thermal Constraints

  • Author

    Li Ling ; Jianhui Jiang

  • Author_Institution
    Sch. of Software Eng., Tongji Univ., Shanghai, China
  • fYear
    2014
  • fDate
    16-19 Nov. 2014
  • Firstpage
    180
  • Lastpage
    185
  • Abstract
    Increasing power density and thermal hotspots has become a major problem for integrated circuits. The problem is exacerbated when applying tests to a System-on-Chip (SoC). Running a test individually may exceed the given temperature threshold. So scheduling tests to reduce the test application time (TAT) while keep the cores thermally safe has become a key issue. Dynamic Voltage and Frequency Scaling (DVFS) has been widely used in modern IC devices to control power and temperature. We exploit such features for thermal-aware test scheduling and propose a method to efficiently determine the scaling factor which leads to optimized TAT without violating the thermal constraints. The proposed method can also be used to efficiently calculate the maximum temperature certain tests can achieve when DVFS is applied. After formulating the problem into an MILP model, experimental results on ITC´02 benchmarks showed that DVFS can be used to deal with power intensive tests efficiently and exploiting such features can achieve up to 16.37% reduction of TAT.
  • Keywords
    integer programming; integrated circuit testing; linear programming; scheduling; system-on-chip; thermal management (packaging); DVFS; ITC´02 benchmarks; MILP model; SoC; TAT; dynamic voltage and frequency scaling; integrated circuits; modern IC devices; power density; scaling factor; system-on-chip; test application time; thermal constraints; thermal hotspots; thermal-aware test scheduling; Benchmark testing; Cooling; Job shop scheduling; System-on-chip; Temperature; DVFS; SoC test scheduling; thermal-aware;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Symposium (ATS), 2014 IEEE 23rd Asian
  • Conference_Location
    Hangzhou
  • ISSN
    1081-7735
  • Type

    conf

  • DOI
    10.1109/ATS.2014.36
  • Filename
    6979097