DocumentCode
1809394
Title
A failure-resilient xDSL line driver with on-chip degradation monitor
Author
De Wit, Pieter ; Gielen, Georges
Author_Institution
Dept. Elektrotech., Katholieke Univ. Leuven, Heverlee, Belgium
fYear
2011
fDate
12-16 Sept. 2011
Firstpage
247
Lastpage
250
Abstract
Continuous scaling to smaller CMOS nodes has introduced die-level degradation effects, reducing the reliability of integrated circuits. This paper presents a failure-resilient xDSL line driver with reconfigurable output-stage, on-chip degradation monitors and system controller, resulting in a guaranteed power efficiency in presence of degradation. Preservation of the power efficiency is verified using voltage-overstressing and temperature variation measurements.
Keywords
digital subscriber lines; driver circuits; temperature measurement; die-level degradation effects; failure-resilient xDSL line driver; on-chip degradation monitor; temperature variation measurements; voltage-overstressing; Degradation; MOS devices; Monitoring; Reliability; Temperature measurement; Temperature sensors; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
ESSCIRC (ESSCIRC), 2011 Proceedings of the
Conference_Location
Helsinki
ISSN
1930-8833
Print_ISBN
978-1-4577-0703-2
Electronic_ISBN
1930-8833
Type
conf
DOI
10.1109/ESSCIRC.2011.6044953
Filename
6044953
Link To Document