Plasma cleaning of various electronic packaging materials to improve adhesion property

Summary form only given, as follows. Advanced integrated circuit packaging processes require high bondability and reliability between various mating surfaces and a key factor affecting this requirements is the surface cleanliness. Contaminants degrading the adhesion property include organic or oxide layers and these impurities should be thoroughly removed before the bonding process. Plasma can be used for this purpose and has many potential advantages-reduction of processing waste, cleaner surface, controllability and a dry process, in comparison to chemical cleaning. A nonthermal plasma generated at atmospheric pressure has been used in cleaning a surface of wire bonding substrates and flip chip bumps widely used in todays packaging industry. The relation between the processing parameters (processing time, gas composition, additional UV exposure) and bonding characteristics has been investigated.