DocumentCode :
1811057
Title :
Silicon Pressure Sensors Using A Wafer-bonded Sealed Cavity Process
Author :
Parameswaran, Lalitha ; Mirza, Andrew ; Chan, Wendy K. ; Schmidt, Martin A.
Volume :
2
fYear :
1995
fDate :
25-29 June 1995
Firstpage :
582
Lastpage :
585
Keywords :
Biomembranes; Capacitive sensors; Circuit testing; Etching; Piezoresistance; Production; Sensor phenomena and characterization; Silicon; Substrates; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on
Conference_Location :
Stockholm, Sweden
Print_ISBN :
91-630-3473-5
Type :
conf
DOI :
10.1109/SENSOR.1995.721898
Filename :
721898
Link To Document :
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