DocumentCode
1811057
Title
Silicon Pressure Sensors Using A Wafer-bonded Sealed Cavity Process
Author
Parameswaran, Lalitha ; Mirza, Andrew ; Chan, Wendy K. ; Schmidt, Martin A.
Volume
2
fYear
1995
fDate
25-29 June 1995
Firstpage
582
Lastpage
585
Keywords
Biomembranes; Capacitive sensors; Circuit testing; Etching; Piezoresistance; Production; Sensor phenomena and characterization; Silicon; Substrates; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on
Conference_Location
Stockholm, Sweden
Print_ISBN
91-630-3473-5
Type
conf
DOI
10.1109/SENSOR.1995.721898
Filename
721898
Link To Document