• DocumentCode
    1811118
  • Title

    Influence of target geometry on maximum electric field in plasma immersion ion implantation

  • Author

    Tian, X. ; Fu, R.K.Y. ; Wang, L. ; Chu, P.K.

  • Author_Institution
    City Univ. of Hong Kong, Kowloon, China
  • fYear
    2001
  • fDate
    17-22 June 2001
  • Firstpage
    561
  • Abstract
    Summary form only given, as follows. Plasma immersion ion implantation (PIII) is an effective surface modification technique. In PIII, a bias voltage is applied to the target to accelerate ions from the surrounding plasma into ate target. The electrical field thus depends very much on the applied voltage, plasma density, target shape, and other instrumental factors. There is a also a maximum electric field to avoid arcing. For pressure lower than 1 Pa, this field strength is on the order of 10kV/mm. In PIII processes, this limiting field strength occurs at the beginning of each voltage pulse because the field decrease as the plasma sheath expands. In the treatment of three-dimensional samples, the field is enhanced at edges or protrusions and the extent depends on the shape and relative dimensions. In this work, we simulate the electrical field around a rhombus-shaped target using the two-dimensional Poisson´s equation. The target geometry is varied from 30 to 150 degrees to demonstrate the effects of the edge angle on the electrical field. We also discuss the influence of the target size, plasma density, and applied voltage on the electrical field.
  • Keywords
    ion implantation; plasma density; plasma materials processing; 1 Pa; applied voltage; effective surface modification technique; electrical field; maximum electric field; plasma density; plasma immersion ion implantation; target geometry; target shape; Acceleration; Geometry; Instruments; Plasma accelerators; Plasma density; Plasma immersion ion implantation; Plasma sheaths; Poisson equations; Shape; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Pulsed Power Plasma Science, 2001. IEEE Conference Record - Abstracts
  • Conference_Location
    Las Vegas, NV, USA
  • Print_ISBN
    0-7803-7141-0
  • Type

    conf

  • DOI
    10.1109/PPPS.2001.961392
  • Filename
    961392