DocumentCode
1812084
Title
Wideband on-chip RF MEMS switches in a BiCMOS technology for 60 GHz applications
Author
Wang, Guoan ; Ding, Hanyi ; Woods, Wayne ; Mina, Essam
Author_Institution
IBM Syst. & Technol. Group, Essex Junction, VT
Volume
3
fYear
2008
fDate
21-24 April 2008
Firstpage
1389
Lastpage
1392
Abstract
In this paper, an on-chip RF MEMS capacitive switch is designed and simulated with a 0.13 mum IBM SiGe BiCMOS technology for the first time. Mechanical and electrical design of the high frequency switch are discussed in this paper. Special consideration to improve Con/Coff ratio of the switch is used with multi metal layers configuration. The switch is designed for 60 GHz wireless applications, the results show that the switch has the insertion loss is less than 0.2 dB when the switch is off, while the isolation loss is larger than 15 dB when the switch is on over the frequency from 40 to 70 GHz. The calculated pull-in voltage of the switch is only about 10 volts, the switch is compact comparing with the reported PIN diode RF switch and has the membrane dimension of 10 mum x 240 mum.
Keywords
BiCMOS integrated circuits; Ge-Si alloys; microswitches; IBM SiGe BiCMOS technology; electrical design; frequency 60 GHz; mechanical design; multimetal layers configuration; on-chip RF MEMS capacitive switch design; size 0.13 mum; wireless applications; BiCMOS integrated circuits; Biomembranes; Germanium silicon alloys; Insertion loss; Radio frequency; Radiofrequency microelectromechanical systems; Silicon germanium; Switches; Voltage; Wideband; 60 GHz; BiCMOS technology; Distributed passives; Millimeter wave components; RF MEMS switch; Silicon-Germanium;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave and Millimeter Wave Technology, 2008. ICMMT 2008. International Conference on
Conference_Location
Nanjing
Print_ISBN
978-1-4244-1879-4
Electronic_ISBN
978-1-4244-1880-0
Type
conf
DOI
10.1109/ICMMT.2008.4540701
Filename
4540701
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