DocumentCode
181261
Title
Optimization of the selenium field-stop profile with respect to softness and robustness
Author
Pertermann, Eric ; Lutz, Josef ; Basler, Thomas ; Schulze, H.-J. ; Felsl, Hans Peter ; Niedernostheide, F.-J.
Author_Institution
Dept. of Power Electron. & EMC, Tech. Univ. Chemnitz, Chemnitz, Germany
fYear
2014
fDate
15-19 June 2014
Firstpage
27
Lastpage
30
Abstract
Tailoring the field-stop layer is an effective measure to increase the switching softness and to improve the avalanche robustness of high-voltage power diodes. Diodes and IGBTs with deeper field-stop layers having a superior switching behavior can be created with a relatively low temperature budget by using selenium as field-stop dopant. In this work, we show that a further improvement of the diode performance can be achieved by using a selenium double-field-stop layer. Providing a CIBH-diode with such a selenium double field-stop layer results in a very soft and robust diode. The characteristic of the selenium traps (donor levels and capture cross sections) are determined by DLTS and by frequency resolved admittance spectroscopy measurements. Simulations of the reverse recovery behavior using these trap properties show good agreement with experimental results and are essential for finding further optimized field stop profiles.
Keywords
avalanche diodes; deep level transient spectroscopy; insulated gate bipolar transistors; selenium; CIBH-diode; DLTS; IGBT; Se; admittance spectroscopy measurements; avalanche robustness improvement; controlled injection of backside holes; deep level transient spectroscopy; diode performance; field-stop dopant; field-stop layer; high-voltage power diodes; low temperature budget; reverse recovery behavior; selenium double field-stop layer; selenium trap characteristic; switching softness; Current measurement; Frequency measurement; Schottky diodes; Semiconductor device measurement; Spectroscopy; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
Conference_Location
Waikoloa, HI
ISSN
1943-653X
Print_ISBN
978-1-4799-2917-7
Type
conf
DOI
10.1109/ISPSD.2014.6855967
Filename
6855967
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