• DocumentCode
    181261
  • Title

    Optimization of the selenium field-stop profile with respect to softness and robustness

  • Author

    Pertermann, Eric ; Lutz, Josef ; Basler, Thomas ; Schulze, H.-J. ; Felsl, Hans Peter ; Niedernostheide, F.-J.

  • Author_Institution
    Dept. of Power Electron. & EMC, Tech. Univ. Chemnitz, Chemnitz, Germany
  • fYear
    2014
  • fDate
    15-19 June 2014
  • Firstpage
    27
  • Lastpage
    30
  • Abstract
    Tailoring the field-stop layer is an effective measure to increase the switching softness and to improve the avalanche robustness of high-voltage power diodes. Diodes and IGBTs with deeper field-stop layers having a superior switching behavior can be created with a relatively low temperature budget by using selenium as field-stop dopant. In this work, we show that a further improvement of the diode performance can be achieved by using a selenium double-field-stop layer. Providing a CIBH-diode with such a selenium double field-stop layer results in a very soft and robust diode. The characteristic of the selenium traps (donor levels and capture cross sections) are determined by DLTS and by frequency resolved admittance spectroscopy measurements. Simulations of the reverse recovery behavior using these trap properties show good agreement with experimental results and are essential for finding further optimized field stop profiles.
  • Keywords
    avalanche diodes; deep level transient spectroscopy; insulated gate bipolar transistors; selenium; CIBH-diode; DLTS; IGBT; Se; admittance spectroscopy measurements; avalanche robustness improvement; controlled injection of backside holes; deep level transient spectroscopy; diode performance; field-stop dopant; field-stop layer; high-voltage power diodes; low temperature budget; reverse recovery behavior; selenium double field-stop layer; selenium trap characteristic; switching softness; Current measurement; Frequency measurement; Schottky diodes; Semiconductor device measurement; Spectroscopy; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
  • Conference_Location
    Waikoloa, HI
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4799-2917-7
  • Type

    conf

  • DOI
    10.1109/ISPSD.2014.6855967
  • Filename
    6855967