Title :
High-performance self-aligned InP/InGaAs DHBTs with a passivation ledge utilizing a thin etching stop layer
Author :
Ohkubo, Yukio ; Matsumoto, Taisuke ; Koji, Takashi ; Amano, Yoshiaki ; Takagi, Akio ; Matsuoka, Yutaka
Author_Institution :
Core Technol. R&D Center, Anritsu Corp., Atsugi
Abstract :
The relation between effective emitter resistance, re eff, and collector current, IC, was investigated for InGaP/GaAs HBTs and InP/InGaAs DHBTs. While the relation between re eff and IC -1 of InGaP/GaAs HBT is linear over a wide range of IC, that of InP/InGaAs DHBT is nonlinear as if re eff in the low collector current region increased more than the dynamic emitter resistance component that is proportional to IC -1. Although this phenomenon is enhanced in InP/InGaAs DHBTs with a thin InGaAs etching stop layer inserted in the emitter to make it controllable to form a ledge passivation structure, the etching stop layer is acceptable in high-performance high-reliability HBT applications. Using an emitter structure with an etching stop layer, we developed self-aligned InP/InGaAs DHBTs with a passivation ledge structure that attained an fT of 302 GHz, fmax of 388 GHz, and BVCEO of 6.2 V.
Keywords :
III-V semiconductors; etching; gallium arsenide; gallium compounds; heterojunction bipolar transistors; indium compounds; passivation; semiconductor device reliability; InGaP-GaAs; emitter resistance; frequency 302 GHz; high-performance HBT applications; high-reliability HBT applications; ledge passivation structure; low collector current region; self-aligned DHBT; thin etching stop layer; voltage 6.2 V; Controllability; Double heterojunction bipolar transistors; Fabrication; Gallium arsenide; Heterojunction bipolar transistors; Indium gallium arsenide; Indium phosphide; Passivation; Substrates; Wet etching; DHBT; Inp; emitter resistance; fT; fmax; ideality factor; ledge;
Conference_Titel :
Indium Phosphide and Related Materials, 2008. IPRM 2008. 20th International Conference on
Conference_Location :
Versailles
Print_ISBN :
978-1-4244-2258-6
Electronic_ISBN :
1092-8669
DOI :
10.1109/ICIPRM.2008.4702947