DocumentCode :
181271
Title :
Comparison of critical current filaments in IGBT short circuit and during diode turn-off
Author :
Baburske, R. ; van Treek, Vera ; Pfirsch, F. ; Niedernostheide, F.-J. ; Jaeger, Christian ; Schulze, H.-J. ; Felsl, Hans Peter
Author_Institution :
Infineon Technol. AG, Neubiberg, Germany
fYear :
2014
fDate :
15-19 June 2014
Firstpage :
47
Lastpage :
50
Abstract :
Device simulations of two-dimensional structures with a huge lateral extension indicate that the combination of lateral current flow and a vertical reduction of space-charge region are necessary for the filament formation during the short-circuit operation of IGBTs and the turn-off of diodes. The shape of the electric-field distribution is introduced as new criterion to estimate the rising branch of the short-circuit destruction curve in the Ic-Vce SOA-diagram. The impact of the stray inductance Lstray and the gate resistor RG on the short-circuit destruction limit are experimentally investigated. The presented results allow a deeper understanding of the different electrical short-circuit failure mechanisms (turn-on, quasi-stationary state, turn-off) and their relation to one another.
Keywords :
insulated gate bipolar transistors; power semiconductor devices; semiconductor device breakdown; semiconductor device reliability; space charge; IGBT short circuit; critical current filaments; diode turn-off; electric field distribution; electrical short-circuit failure mechanisms; lateral current flow; lateral extension; short circuit destruction curve; short circuit destruction limit; space-charge region; stray inductance; two-dimensional structure; Clamps; Current density; Insulated gate bipolar transistors; Logic gates; Plasmas; Thyristors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
Conference_Location :
Waikoloa, HI
ISSN :
1943-653X
Print_ISBN :
978-1-4799-2917-7
Type :
conf
DOI :
10.1109/ISPSD.2014.6855972
Filename :
6855972
Link To Document :
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