• DocumentCode
    181279
  • Title

    Avalanche behaviour and its temperature dependence of commercial SiC MPS diodes: Influence of design and voltage class

  • Author

    Rupp, R. ; Gerlach, R. ; Kabakow, A. ; Schorner, R. ; Hecht, C. ; Elpelt, R. ; Draghici, M.

  • Author_Institution
    Infineon Technol. AG, Erlangen, Germany
  • fYear
    2014
  • fDate
    15-19 June 2014
  • Firstpage
    67
  • Lastpage
    70
  • Abstract
    The avalanche behavior of 650V and 1200V SiC Merged-PN-Schottky diodes was investigated as function of temperature by means of electrical measurements, simulation and optical detection of the avalanche rated electroluminescence. A very good fit between the simulated and experimentally determined breakdown field strengths could be achieved. The TC of the avalanche was 0.14V/K resp. 0.35V/K for the 650V and 1200V devices. For both voltage classes EBr was ~3.3MV/cm, clearly above the value of 2.5MV/cm which is frequently assumed in literature for 4H SiC. The devices can withstand long term continuous avalanche as well as single pulse avalanche with a junction temperature rise of ~200°C. Finally the observations are compared with the avalanche behavior of SiC JFETs. As expected, these FETs show comparable T-dependence and electroluminescence patterns as the diodes.
  • Keywords
    Schottky diodes; avalanche breakdown; electroluminescence; power semiconductor diodes; semiconductor device breakdown; silicon compounds; wide band gap semiconductors; MPS diode; SiC; avalanche behaviour; avalanche rated electroluminescence; breakdown field strength; continuous avalanche; merged pn-Schottky diodes; single pulse avalanche; temperature dependence; voltage 1200 V; voltage 650 V; voltage class; Current density; JFETs; Junctions; Luminescence; Schottky diodes; Silicon carbide; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
  • Conference_Location
    Waikoloa, HI
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4799-2917-7
  • Type

    conf

  • DOI
    10.1109/ISPSD.2014.6855977
  • Filename
    6855977