Title : 
Work in progress — Exploiting high-altitude ballooning as a framework of ECE Senior Design projects
         
        
            Author : 
Lee, Wookwon ; Mak, Fong K.
         
        
            Author_Institution : 
Gannon Univ., PA, USA
         
        
        
        
            Abstract : 
Senior Design is a challenging course for both students and the instructor and/or faculty advisors. To design the course that can create enjoyable learning environment and be effective in addressing the ABET criteria for student outcomes, we have adopted a high-altitude weather ballooning as the framework of projects for Senior Design. It is envisioned that the new framework better develops students´ ability for teamwork and effective communication, as well as, encouraging them to apply appropriate technical knowledge acquired through their overall education in electrical and computer engineering. In this Work-in-Progress paper, we describe our approach to formulating design projects for a high-altitude weather ballooning system. From the progress so far, we have observed that the design of a complete weather ballooning system is suitable for 3 teams each of which consists of 3 or 4 students, and that further revisions and enhancements may be suitable for 1 or 2 teams of students in subsequent years.
         
        
            Keywords : 
educational courses; engineering education; meteorology; physics education; student experiments; ABET criteria; ECE senior design projects; computer engineering; effective communication; electrical engineering; enjoyable learning environment; high-altitude weather ballooning system; overall education; project framework; student ability; student outcomes; teamwork; technical knowledge; Computers; Conferences; Education; Global Positioning System; Meteorology; Payloads; Prototypes; ABET student outcomes; high-altitude ballooning; near-space exploration; senior design projects;
         
        
        
        
            Conference_Titel : 
Frontiers in Education Conference (FIE), 2010 IEEE
         
        
            Conference_Location : 
Washington, DC
         
        
        
            Print_ISBN : 
978-1-4244-6261-2
         
        
            Electronic_ISBN : 
0190-5848
         
        
        
            DOI : 
10.1109/FIE.2010.5673603