DocumentCode :
181352
Title :
A segmented output stage H-bridge IC with tunable gate driver
Author :
Yu, J.S. ; Zhang, W.J. ; Ng, W.T.
Author_Institution :
Edward S. Rogers Sr. Dept. of Electr. & Comput. Eng., Univ. of Toronto, Toronto, ON, Canada
fYear :
2014
fDate :
15-19 June 2014
Firstpage :
205
Lastpage :
208
Abstract :
In this paper, an integrated EDMOS H-bridge that incorporates both segmented output transistors and segmented gate drivers is presented. This fully segmented design approach allows the output resistance of the H-bridge and the output resistance of the gate drivers to be dynamically adjusted. Dynamic adjustment of these parameters allows for the continuous optimization of the power conversion efficiency of the H-bridge over a wide range of output currents. The IC chip is fabricated using TSMC´s 0.18 μm BCD Gen-2 process technology. The H-bridge is operated with a 10 V input, 2 V output and a load current between 0.02 A and 4 A. The presented design achieves power conversion efficiency improvements of 32% and 8% at light load current and heavy load current, respectively, when compared to traditional fixed power transistor designs. Furthermore, the dynamically adjustable output resistance of the gate drivers allows for suppression of switching node ringing and conducted EMI (CEMI) by 5.5 dB with no a significant reduction in efficiency.
Keywords :
BIMOS integrated circuits; bridge circuits; driver circuits; electromagnetic interference; integrated circuit design; interference suppression; BCD Gen-2 process technology; H-bridge integrated circuit; conducted EMI suppression; current 0.02 A to 4 A; fully segmented design; integrated EDMOS H-bridge; power conversion efficiency; segmented gate driver; segmented output stage; segmented output transistor; size 0.18 mum; switching node ringing suppression; tunable gate driver; voltage 10 V; voltage 2 V; Integrated circuits; Logic gates; Optimization; Power conversion; Resistance; Switches; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
Conference_Location :
Waikoloa, HI
ISSN :
1943-653X
Print_ISBN :
978-1-4799-2917-7
Type :
conf
DOI :
10.1109/ISPSD.2014.6856012
Filename :
6856012
Link To Document :
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