• DocumentCode
    181378
  • Title

    Static and dynamic performance evaluation of > 13 kV SiC p-channel IGBTs at high temperatures

  • Author

    Deguchi, Tadayoshi ; Mizushima, Tomonori ; Fujisawa, Hiroyuki ; Takenaka, Kana ; Yonezawa, Yoshiyuki ; Fukuda, Kenji ; Okumura, Hajime ; Arai, Manabu ; Tanaka, A. ; Ogata, Syuuji ; Hayashi, Teruaki ; Nakayama, Keisuke ; Asano, Katsunori ; Matsunaga, Shin-

  • Author_Institution
    Adv. Power Electron. Res. Center (ADPERC), Tsukuba, Japan
  • fYear
    2014
  • fDate
    15-19 June 2014
  • Firstpage
    261
  • Lastpage
    264
  • Abstract
    To examine the effect of the device structure on the on-state voltage (Von), several types of ultrahigh-voltage 4H-SiC p-channel insulated-gate bipolar transistors (IGBTs) were fabricated. A p-channel IGBT with a retrograde charge storage layer (CSL) and an additional JFET ion implantation region exhibited the lowest Von at 200 °C. To obtain a blocking voltage (BV) greater than 13 kV, a junction termination extension (JTE)-dose dependence of the BV was also investigated. Furthermore, ampere-class p-channel IGBTs with optimized device structures were fabricated for the evaluation of the switching loss (5 kV/1 A). Although the turn-off loss increased with an increase in the temperature, the loss remained as low as less than 10 mJ up to 250 °C. This performance renders the ultrahigh-voltage 4H-SiC p-channel IGBTs suitable for high-temperature and high-power applications.
  • Keywords
    insulated gate bipolar transistors; ion implantation; junction gate field effect transistors; power bipolar transistors; power semiconductor devices; semiconductor device manufacture; silicon compounds; wide band gap semiconductors; JFET ion implantation; SiC; blocking voltage; charge storage layer; dynamic performance evaluation; insulated-gate bipolar transistors; junction termination extension; p-channel IGBT; static performance evaluation; temperature 200 C; temperature 250 C; voltage 13 kV; Insulated gate bipolar transistors; Ion implantation; Junctions; Performance evaluation; Silicon carbide; Temperature; Temperature measurement; Silicon carbide (SiC); charge storage layer (CSL); insulated-gate bipolar transistor (IGBT); junction termination extension (JTE); p-channel; switching loss;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
  • Conference_Location
    Waikoloa, HI
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4799-2917-7
  • Type

    conf

  • DOI
    10.1109/ISPSD.2014.6856026
  • Filename
    6856026