DocumentCode :
181378
Title :
Static and dynamic performance evaluation of > 13 kV SiC p-channel IGBTs at high temperatures
Author :
Deguchi, Tadayoshi ; Mizushima, Tomonori ; Fujisawa, Hiroyuki ; Takenaka, Kana ; Yonezawa, Yoshiyuki ; Fukuda, Kenji ; Okumura, Hajime ; Arai, Manabu ; Tanaka, A. ; Ogata, Syuuji ; Hayashi, Teruaki ; Nakayama, Keisuke ; Asano, Katsunori ; Matsunaga, Shin-
Author_Institution :
Adv. Power Electron. Res. Center (ADPERC), Tsukuba, Japan
fYear :
2014
fDate :
15-19 June 2014
Firstpage :
261
Lastpage :
264
Abstract :
To examine the effect of the device structure on the on-state voltage (Von), several types of ultrahigh-voltage 4H-SiC p-channel insulated-gate bipolar transistors (IGBTs) were fabricated. A p-channel IGBT with a retrograde charge storage layer (CSL) and an additional JFET ion implantation region exhibited the lowest Von at 200 °C. To obtain a blocking voltage (BV) greater than 13 kV, a junction termination extension (JTE)-dose dependence of the BV was also investigated. Furthermore, ampere-class p-channel IGBTs with optimized device structures were fabricated for the evaluation of the switching loss (5 kV/1 A). Although the turn-off loss increased with an increase in the temperature, the loss remained as low as less than 10 mJ up to 250 °C. This performance renders the ultrahigh-voltage 4H-SiC p-channel IGBTs suitable for high-temperature and high-power applications.
Keywords :
insulated gate bipolar transistors; ion implantation; junction gate field effect transistors; power bipolar transistors; power semiconductor devices; semiconductor device manufacture; silicon compounds; wide band gap semiconductors; JFET ion implantation; SiC; blocking voltage; charge storage layer; dynamic performance evaluation; insulated-gate bipolar transistors; junction termination extension; p-channel IGBT; static performance evaluation; temperature 200 C; temperature 250 C; voltage 13 kV; Insulated gate bipolar transistors; Ion implantation; Junctions; Performance evaluation; Silicon carbide; Temperature; Temperature measurement; Silicon carbide (SiC); charge storage layer (CSL); insulated-gate bipolar transistor (IGBT); junction termination extension (JTE); p-channel; switching loss;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
Conference_Location :
Waikoloa, HI
ISSN :
1943-653X
Print_ISBN :
978-1-4799-2917-7
Type :
conf
DOI :
10.1109/ISPSD.2014.6856026
Filename :
6856026
Link To Document :
بازگشت